美國(guó)UDM AKLC300系列濃縮晶圓切削液
l AKLC300洗滌劑濃縮液是一種可生物降解、水性、非堿性、非酸性物質(zhì)
l PV wafer Cleaning after wafering
用于切片之后對(duì)光伏硅片進(jìn)行清洗
l DI /RO water: Detergent dilution ratio – 1000:1 to 500 :1
去離子水/反滲透水:洗滌劑溶液比例 – 1000:1至500:1
l Application temperature: 45°C - 70°C
使用溫度：45°C - 70°C
l Excellent wetting, cleaning and rinsing properties
極好的濕潤(rùn)、清潔和沖洗功能
l Water surface tension reducer
降低去離子水/反滲透水表面張力
l Completely cleans out SiC (silicon carbide) dust and other contaminants on wafer surfaces
可以徹底清潔硅片表面的碳化硅(SiC)塵埃以及其他臟污
l Cleans and eliminates Cu (Copper) and Fe (Iron) on PV wafer surfaces after wafering and De-gluing process.
在切片以及去膠工序之后徹底清除光伏硅片表面的銅和鐵
l Biodegradable, non-hazardous and hence easily disposable
可生物降解、無(wú)危害，可以很容易進(jìn)行處置
l Biochemical Oxygen Demand (BOD) < 2.0 mg/L (BOD less than 2.0 mg/L)
生化需氧量(BOD) < 2.0 mg/L (BOD小于2.0 mg/L)
l Chemical Oxygen Demand (COD) < 10.0 mg/L (COD less than 10.0 mg/L)
化學(xué)需氧量(COD) < 10.0 mg/L (COD小于10.0 mg/L)
聯(lián)系人：陳先生
手機(jī)：13602588976
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